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Author Archives: Harjit Singh
Pinion interfering with the tire
When I applied power to the motors on Zeetah VI (ZVI) for the first time, the motors seemed to struggle and the PWM value to get the wheels to rotate seemed higher than usual. Since this was my first four … Continue reading
Posted in Hardware, Micromouse
Tagged file, friction, interefere, interference, pinion, sand, tire
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Finishing the new maze floor
The walls and posts arrived and so it was time to finish the maze floor.
Comparing the ADXRS610 and ADXRS642 gyros
Analog Devices recently release new vibration rejection gyros which seemed a perfect fit for use on a micromouse. Since I was using the ADXRS610 on Zeetah V, I temporarily mounted an ADXRS642 to ZV to compare the two.
Soldering the gyro
Finally, a way to solder the Analog Devices ADXRS610 gyro… The last time we attached a gyro, we overheated the board and the board delaminated. This time, we use a skillet and avoided that problem.
Painting the floor
Once the panels dried out, it was time to paint them.
Making the floor
Now that I had the layout, the next step was to cut and drill the plywood. While there are many techniques for doing this, I ended up getting help from a friend who has access to water jet cutters to … Continue reading
Designing a maze floor
Given standard sizes for plywood, here is a pattern I used to make a maze floor.
How many walls do you need for a square maze?
At the Japanese contest, Peter said there is a closed form solution for the maximum number of walls a legal micromouse maze can have.
Zeetah V’s path in the 2011 All Japan Qualfication
Once ZV had explored the maze, it did a speed run and the path it took in the upper right portion of the maze was very different than the other competitors.
Posted in Japan
2 Comments
Using a skillet for soldering?
Experimenting with other ways to solder parts.
After the problem with soldering the gyro, I decided to experiment with using a skillet to solder parts (http://www.sparkfun.com/tutorials/59).
Since I didn’t have a solder paste stencil, I experimented with putting down solder-paste freeform.
The end results aren’t that great. I think a solder stencil or some other method of precise, consistent deposition of solder paste is a must.
Top view:
Top view of solder paste and then soldered part:
North West edge:
South West edge:
South East Edge:
North East edge:
There is decent wetting in the end result but the chip didn’t seem to flatten out and sink. I think the solder profile was not steep enought i.e. I should have heated up the board faster.
I was thinking of using a stencil and manually loading all the parts when I make another board (because of the delamination on the first one), but I think I will make a stencil only for the gyro, attach that and then manually solder the rest of the parts.
Posted in Hardware
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